Open package form-stable phase change microspheres with low thermal contact resistance for the thermal management of electronic devices

Autor: Liu, Changqing, Yu, Wei, Fan, Junhui, Li, Yifan, Chen, Jin, Fu, Jun, Peng, Guilong, Liu, Jianying
Zdroj: In Applied Thermal Engineering 15 March 2024 241
Databáze: ScienceDirect