Open package form-stable phase change microspheres with low thermal contact resistance for the thermal management of electronic devices
Autor: | Liu, Changqing, Yu, Wei, Fan, Junhui, Li, Yifan, Chen, Jin, Fu, Jun, Peng, Guilong, Liu, Jianying |
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Zdroj: | In Applied Thermal Engineering 15 March 2024 241 |
Databáze: | ScienceDirect |
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