Advanced Hi-Fill ® for interconnect liner applications
| Autor: | Urbansky, N ∗, Burgess, S.R, Schmidbauer, S, Heydenreich, U, Donohue, H, Moncrieff, I, Görgens, C |
|---|---|
| Zdroj: | In Microelectronic Engineering 2002 64(1):99-105 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect