Surface blistering of low temperature annealed hydrogen and helium co-implanted germanium and its application to splitting of bonded wafer substrates

Autor: Hurley, R.E., Wadsworth, H., Montgomery, J.H., Gamble, H.S.
Zdroj: In Vacuum 2009 83 Supplement 1:S29-S32
Databáze: ScienceDirect