Etching kinetics and dielectric properties of SiOC films exposed to Ar and CF4 plasmas

Autor: Oh, Younghun a, Efremov, Alexander b, Lee, Junmyung a, Lee, Jongchan a, Choi, Yeonsik a, Kwon, Kwang-Ho a, ⁎
Zdroj: In Thin Solid Films 1 May 2022 749
Databáze: ScienceDirect