Popis: |
Wettable flank technology is an emerging solution for the customer requirement of visually detectable solder joints for high reliability application. Herein, we present a strategy to realize this challenging technology. The use of ultra-short pulsed laser for the ablation of epoxy mold compound or copper frames to create the partial cut in a quad flat no lead (QFN) package resulted in the successful creation of a sidewall, which can be electroplated with solderable material such as tin to create wettable QFNs. |