Ultra-Short Pulsed Laser Ablation of Epoxy Mold Compound or Copper Frames for Partial Cut QFNs
| Autor: | Ernesto Antilano Jr., Ian Harvey Arellano |
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| Rok vydání: | 2019 |
| DOI: | 10.5281/zenodo.2656361 |
| Popis: | Wettable flank technology is an emerging solution for the customer requirement of visually detectable solder joints for high reliability application. Herein, we present a strategy to realize this challenging technology. The use of ultra-short pulsed laser for the ablation of epoxy mold compound or copper frames to create the partial cut in a quad flat no lead (QFN) package resulted in the successful creation of a sidewall, which can be electroplated with solderable material such as tin to create wettable QFNs. |
| Databáze: | OpenAIRE |
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