Automatic Image Analysis of Stackingfault
Autor: | Annamaria Muoio, Cristiano Calabretta, Viviana Scuderi, Massimo Zimbone, Francesco La Via |
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Rok vydání: | 2022 |
Předmět: | |
Zdroj: | Materials Science Forum. 1062:283-287 |
ISSN: | 1662-9752 |
DOI: | 10.4028/p-ad93l3 |
Popis: | 3C silicon carbide is a semiconductor with remarkable properties, making it ideal for the development of long lasting devices, working in harsh environments and under high particle flows. The most significant obstacle to its wider diffusion is the presence of extended, bidimensional and linear defects in its crystal lattice. The purpose of this research is to automatically recognize defects from a TEM image by algorithm that calculates distances and angles. |
Databáze: | OpenAIRE |
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