Foreword Wafer-Level Packaging: Interconnects for Enhanced Reliability

Autor: Luu T. Nguyen
Rok vydání: 2009
Předmět:
Zdroj: IEEE Transactions on Advanced Packaging. 32:360-361
ISSN: 1557-9980
1521-3323
DOI: 10.1109/tadvp.2009.2022602
Popis: The four articles in this special section focus on wafer-level packaging and interconnects for enhanced reliability.
Databáze: OpenAIRE
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