Foreword Wafer-Level Packaging: Interconnects for Enhanced Reliability
| Autor: | Luu T. Nguyen |
|---|---|
| Rok vydání: | 2009 |
| Předmět: |
Engineering
Wafer-scale integration Reliability (semiconductor) business.industry Hardware_INTEGRATEDCIRCUITS Electrical engineering Special section Electronic packaging Thermal management of electronic devices and systems Electrical and Electronic Engineering business Wafer-level packaging Engineering physics |
| Zdroj: | IEEE Transactions on Advanced Packaging. 32:360-361 |
| ISSN: | 1557-9980 1521-3323 |
| DOI: | 10.1109/tadvp.2009.2022602 |
| Popis: | The four articles in this special section focus on wafer-level packaging and interconnects for enhanced reliability. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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