Fatigue Life Prediction of Solder Joints with the Consideration of High-Temperature Degradation

Autor:	Yasuhiro Naka, Ryosuke Kimoto, Kenichi Yamamoto, Hisashi Tanie, Kenya Kawano
Rok vydání:	2014
Předmět:	Materials science Soldering Degradation (geology) Electrical and Electronic Engineering Composite material
Zdroj:	Journal of The Japan Institute of Electronics Packaging. 17:123-131
ISSN:	1884-121X 1343-9677
DOI:	10.5104/jiep.17.123
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bb676553094d34ac9da2c48c2a564e7a https://doi.org/10.5104/jiep.17.123 Zobrazit plný text záznamu