A rapid life-prediction approach for solder joints based on modified Engelmaier fatigue model
| Autor: | Zhou Guifa, Kuang Fen, Xu Wang, Yuxiong Pan |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
business.industry Computer science 020208 electrical & electronic engineering Failure data 02 engineering and technology Structural engineering Temperature cycling Condensed Matter Physics 01 natural sciences Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Vibration Remaining life Soldering 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Life test Electrical and Electronic Engineering Safety Risk Reliability and Quality business Test data |
| Zdroj: | Microelectronics Reliability. 114:113844 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2020.113844 |
| Popis: | Accelerated life test (ALT) is widely used to predict life of solder joints nowadays, and how to shorten the test time and improve the precise of evaluation is one of the most important issues. Based on statistical results of field failure for solder joints, improved ALT under combined thermal cycling and vibration loading conditions was designed and carried out. This paper presents a modified Engelmaier fatigue model to predict life of solder joints, by taking into account field failure data and ALT testing data. The results show that test time of improved ALT is more shorter than conventional one, and the result of remaining life prediction based on modified Engelmaier fatigue model becomes more precise due to improving life model and increasing information. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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