Comparing various test environments for conformal coating evaluation
Autor: | P. Singh, L. Palmer, M. Smith, D. S. Citrin, A. Locquet, D. Hampannavar, H. Fu, M. M. Khaw, K-L Tan, C. Xu, J. Kaufman, M. Pudas, H. Schweigart, S. Strixner, M. R. Meier, C. Wang, H. Akbari |
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Rok vydání: | 2022 |
Zdroj: | 2022 International Conference on Electronics Packaging (ICEP). |
DOI: | 10.23919/icep55381.2022.9795654 |
Databáze: | OpenAIRE |
Externí odkaz: |