Comparing various test environments for conformal coating evaluation

Autor: P. Singh, L. Palmer, M. Smith, D. S. Citrin, A. Locquet, D. Hampannavar, H. Fu, M. M. Khaw, K-L Tan, C. Xu, J. Kaufman, M. Pudas, H. Schweigart, S. Strixner, M. R. Meier, C. Wang, H. Akbari
Rok vydání: 2022
Zdroj: 2022 International Conference on Electronics Packaging (ICEP).
DOI: 10.23919/icep55381.2022.9795654
Databáze: OpenAIRE