Probing the Future of Failure Analysis

Autor: David P. Vallett
Rok vydání: 2002
Předmět:
Zdroj: EDFA Technical Articles. 4:5-9
ISSN: 1537-0755
DOI: 10.31399/asm.edfa.2002-4.p005
Popis: A review of the 2001 edition of the International Technology Roadmap for Semiconductors indicates major obstacles ahead. Of the three basic failure analysis steps—inspection, deprocessing, and fault isolation—the latter is the most at risk, especially physical fault isolation.
Databáze: OpenAIRE