Probing the Future of Failure Analysis
Autor: | David P. Vallett |
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Rok vydání: | 2002 |
Předmět: | |
Zdroj: | EDFA Technical Articles. 4:5-9 |
ISSN: | 1537-0755 |
DOI: | 10.31399/asm.edfa.2002-4.p005 |
Popis: | A review of the 2001 edition of the International Technology Roadmap for Semiconductors indicates major obstacles ahead. Of the three basic failure analysis steps—inspection, deprocessing, and fault isolation—the latter is the most at risk, especially physical fault isolation. |
Databáze: | OpenAIRE |
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