Localization of Dead Open in a Solder Bump by Space Domain Reflectometry

Autor: David P. Vallett, Vladimir V. Talanov, Antonio Orozco, Daniel A. Bader, Nicolas Gagliolo, Jan Gaudestad
Rok vydání: 2012
Předmět:
Zdroj: International Symposium for Testing and Failure Analysis.
ISSN: 0890-1740
DOI: 10.31399/asm.cp.istfa2012p0017
Popis: Space Domain Reflectometry (SDR) is a newly developed non-destructive failure analysis (FA) technique for localizing open defects in both packages and dies through mapping in space domain the magnetic field produced by a radio frequency (RF) current induced in the sample, herein the name Space Domain Reflectometry. The technique employs a scanning superconducting quantum interference device (SQUID) RF microscope operating over a frequency range from 60 to 200 MHz. In this paper we demonstrate that SDR is capable of locating defective micro bumps in a flip-chip device.
Databáze: OpenAIRE