Transfer of structured and patterned thin silicon films using the Smart-Cut® process.

Autor: Aspar, B., Bruel, M., Zussy, M., Cartier, A.M.
Zdroj: Electronics Letters (Institution of Engineering & Technology); 10/10/1996, Vol. 32 Issue 21, p1985-1986, 2p
Databáze: Complementary Index