Highly stable partial body tied SOI CMOS technology with Cu interconnect and low-k dielectric for high performance microprocessor.
| Autor: | Kim, Y.W., Oh, C.B., Kang, H.S., Oh, M.H., Yoo, S.H., Chung, M.K., Kim, B.S., Suh, K.P. |
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| Zdroj: | IEEE International 2002 SOI Conference; 2002, p119-120, 2p |
| Databáze: | Complementary Index |
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