Establishing the Pad Design Criteria for Assembly Yield
| Autor: | WANG, PING-SEN, 王秉森 |
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| Rok vydání: | 2019 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 108 Nowadays, electronic products are pursuing lightness and thinness, which has led to the development of electronic packaging technology towards miniaturization, high-volume, and high-density technology. System in package (SiP) meets the needs of miniaturization and high performance, and has been favored by the industry in recent years.In the system-level packaging process, Surface Mount Technology (SMT) has always been a key process for system in packages; For system manufacturers, how to improve the fine pitch mount is an important topic in SiP packaging. in response to SiP miniaturization, the size of the component body is reduced, the pitch is also shorter, the difficulty of the process capability of the process is also enhanced, and the number of variables affecting the yield are numerous. In this study, the Taguchi parameter experiment was applied, and the standard deviation of the solder paste printing volume on the passive component pad was used, and the quality characteristics related to the SMT process yield were the response values, while the important design and process parameters related to the SMT process were the control factors; And the arrangement of the components on the board, the offset of the pad, and the mounting offset of the component are the noise factors, so as to effectively formulate the placement criteria of the SiP of the passive component. Let the optimal process parameters conduct Confirmation Test. The results showed that the calculation results are all within the range and represent the success of the experiment. The optimal process parameter can effectively formulate the placement criteria in SiP high mounting yield |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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