Theoretical analysis and numerical simulation of the two-dimensional thermal conduction problem

Autor: LIN, YING-XUAN, 林映萱
Rok vydání: 2019
Druh dokumentu: 學位論文 ; thesis
Popis: 107
In this paper, the problem of heat conduction is considered as the direction of thermal conduction under the influence of temperature. Firstly, the theoretical analysis of the two-dimensional steady heat conduction problem is used as a method to analyze piezoelectric ceramic materials, and is derived through the equilibrium equation and material combination law. The interaction between the mechanical field, the electrical field and the temperature field of the piezoelectric ceramic material is obtained. The Fourier transform technique, the transformation relationship and the principle of superposition of image method are used to obtain the infinite domain, the semi-infinite domain and the quarter plane. Under the condition of a point heat source and different boundary conditions, construct the analytical solutions of the temperature and heat flux fild. Finally, the analytical solution is added to the concept of image method to obtain the analytical solution of the steady-state heat conduction problem of polar coordinates. Similarly, using the Merlin conversion technique, the heat transfer problem of the fan source in the infinite angle domain and the finite length is obtained, or even the full-field analytical solution of the heat source distribution in any angle. In this paper, any The theoretical analytical solutions of the two-dimensional steady-state heat transfer problem are superimposed by a simple functional form. In the last chapter, the ANSYS finite element analysis software is used to analyze the heat flow field and the temperature field, and the finite element analysis result map is matched with the numerical analysis result map of the theoretical analytical solution. The results are superimposed and compared, and the results are nearly identical. The accuracy of the practice, and a better understanding of the basic principles of heat conduction, as well as the temperature changes on the piezoelectric ceramic material, if the temperature field is obtained, the thermal stress and piezoelectric effect of the piezoelectric ceramic material should be further analyzed. Will be a good foundation.
Databáze: Networked Digital Library of Theses & Dissertations