The Study of the Enhancement for Bumping Dielectric Layer Process of Fan-out Wafer Level Package
| Autor: | Jun-De Wu, 吳俊德 |
|---|---|
| Rok vydání: | 2018 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 107 Fan-out wafer level packaging (FOWLP) has been developed gradually. However, the delamination is an unsolved problem. This study focused on the interfacial characteristics between Polyimide (PI) and Redistribution layer (RDL) for the FOWLP to decrease delamination. By plasma treatment, and with different level of powers, gas and plasma, the adhesion between PI and RDL was enhanced in order to strengthen the overall structure and stability of FOWLP. In this study, the problems of delamination were solved by simulation and experiment, respectively. In terms of the simulation, the finite element analysis was used to simulate the FOWLP packaging process, and the software ANSYS was used to calculate the maximum stress value of the FOWLP structure, and there were two ways used to reduce the stress: changing the thickness of each PI layer, and adding a heat treatment process before reflow. After simulation by ANSYS, it was calculated that adding a heat treatment process can effectively reduce the maximum stress value of FOWLP, and so as changing the thickness of PI in each layer. In the experiment process, the physical and chemical properties were discussed with plasma treatment where as the surface roughness was observed via atomic force microscope (AFM), and the relationship between roughness and delamination was obtained by contact angle experiment. In the discussion of chemical properties, the surface energy was obtained by measuring the contact angle, and the surface compounds was analyzed by X-ray photoelectron spectroscopy (XPS). Then, the Taguchi design of experiment was used to find the optimal process parameters and key factors. By changing the parameters of key factor, the mechanism of RDL after the plasma treatment was explored, in order to enhance the surface energy and adhesion. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
| Externí odkaz: |
|