UPH Improvement and Reliability Analysis of Experimental Plasma Cleaning and Sealing Time
| Autor: | Kuan-Ming Chen, 陳冠銘 |
|---|---|
| Rok vydání: | 2019 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 107 In order to overcome the semiconductor industrys Cycle time problem, two parts will be studied through this study. The first part will study the plasma-activated substrate time, and use the Dummy test to see if the three cleaning parameters meet the best regulations. In the following, the time is 200/250/300 seconds to improve the bottleneck of the time spent on the process. The second study is to use Dummy to investigate whether the product is mutated by using three different injection times (Molding), respectively. 150/180 seconds to test the test, the parameter adjustment is used as the analysis without changing the process setting. The length of the plasma cleaning in the study will affect the bonding degree of Epoxy Molding Compound (EMC) and the substrate, so 300 seconds is used. After the SPEC-compliant sample is used to test the Molding time (Cure time), it is known that the length of time will also affect the variation of the product. Therefore, the original parameter is changed from 220 seconds to 180 seconds to test the product. After the reliability analysis test, it is confirmed that the product will not mutate, so in the process improvement, Cure time can be used for 180 seconds to overcome the bottleneck of the sealing station, which is reduced by 220 seconds. 180 seconds, every job a considerable reduction film 25% Cure time consuming. Keywords: sealant hole, film seal process, HPH, reduce Cure time, reliability test |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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