The Characterization of Thermal Deformation of Wafer Level Package Using Michelson Interference Method
| Autor: | CHEN,CHIH-CHIAO, 陳志僑 |
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| Rok vydání: | 2018 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 106 In response to the fast development for smaller package size and thinner substrate structure in advanced IC packaging，the measurement of warpage become a key verification task. It is a strong demand of a fast and accurate surface warpage inspection to be in-planted for wafer level package process line. This thesis is focus on the study of the application of Michelson interference system to measurement the small warpage of a wafer level package. A Michelson interferometer system using a 633 nm He-Ne laser source was built to form an interference fringes of a wafer level CSP(chip size package) sample on a CCD camera. MATLAB program was developed to calculate the optical path difference by applying 5-steps of phase method. The result shows that by using Michelson interference method is able to measure the surface profile changes of a wafer level CSP package at different temperature. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
| Externí odkaz: |
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