Study on Thermoelectric Conversion and Conjugate Heat Transfer for PCBA by Finite Element Analysis
| Autor: | TU, HONG-WEI, 涂宏維 |
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| Rok vydání: | 2018 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 106 In this study, the simulation parameters obtained from experiment were used to verify the heat transfer parameters of graphene thermal interface materials (TIMs) on a single wafer. The optical and power parameters of the unfilled high-power commercial LED lighting are measured by using integrating sphere and power analyzer in order to establish a fast and accurate simulation mode. The heat dissipation effects of composite and multilayer graphene-made TIMs in a closed and compact space are investigated using the heat-radiating materials with different thermal emissivity. By applying the established simulation mode, the simulation error in the main heating source of the light-emitting diode is between 3% and 5%. The use of composite graphene-made TIMs in the LED device can effectively reduce the operating temperature of the PCBA in a closed and compact space. The experimental result of temperature drop of the wafer is up to 6.8 ° C and the simulation result shows the temperature drop is up to 3.9 ° C. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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