Improving Warpage of Duble-Sided Substrate Based on System in Package
| Autor: | Chen Yu-Chuan, 陳昱全 |
|---|---|
| Rok vydání: | 2018 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 106 Popularity and volume requirements of modern electronic goods has become increasingly smaller,which is desirable in substrate to save more space,and more defined features can be increased in the restricted-size substrate,The direction of the current study is to disposemore,double-sided component on the area of the Substrate, by reinforcing elements on the substrate to increase density.On the other hand,the manufacturing time is shortened to reduce costs and increase profits. The current system-in-package technology has been very mature,and it processes a more higher level than the surface-mount technology generally used in the process. However, in terms of process technology, it has been constantly updated,Instead of the previous technology, we can achieve the needs that are now made above,This study explores the use of printed solder paste for system in package technology on double-sided processes, printed solder stencil,and reflow process improvement analysis to shorten the time and cost of the bad rework,to get the best process flow. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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