Evaluation of Application Feasibility of Black Solder Resist Film for Preparation of Embedded Substrate
| Autor: | HUANG,YUNG-CHIH, 黃勇智 |
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| Rok vydání: | 2018 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 106 The embedded structure carrier board is a thin type carrier board formed by inserting an integrated circuit (IC) into the inside of the print circuit board. Forming the exterior of an embedded structure carrier board with the black dry film solder mask technology is still under developing. Due to high price of structure carrier board and unique color of the black dry film solder mask, there are currently no other carrier board manufacturers involved in the evaluation and production except very few leading manufacturers, therefore there is no relevant public technical literature provided for the industry reference. This evaluation study is mainly to find the optimal parameters of operation for the black dry film solder mask in the photolithography process. In these experiments, the printed circuit board and the embedded structure carrier board were used as the substrate, and the black dry film solder mask as the soldering resist, by different batch testing stages of engineering batch, trial batch and sample batch, to verify the CPK (Process Capability Index) meets the definition of statistical stability, and through the reliability test to check the result to verify rationality of the parameters. Experimental results show that the opening and the thickness of the solder resist after photolithography and cure are both in compliance with the specifications. The CPK, being greater than 1.33, has corresponded the statistically definition. And the sampled samples have met the required specifications of the reliability test specifications. This overall result indicates the obtained parameters can be used in this photolithography process conditions, and proves that the black dry film solder mask can be applied in the mass production of this embedded structure carrier board. Keyword： dry film, solder resist, black solder resist film, embedded substrate, uv-cure, thermal cure. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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