Using Taguchi Method to Optimal the Parameters for Desmear of A Company
| Autor: | Huang, Po-Rong, 黃柏榮 |
|---|---|
| Rok vydání: | 2018 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 106 The purpose of this study was to discuss the method of Taguchi method to investigate the blind hole bottom resin residue after laser blind hole processing in the Flip Chip carrier board process. Slag removal parameters. The method of removing the residual resin residue in the blind hole at the desmearing equipment depends on the equipment parameters and the ratio of the potency concentration, such as (1) Sweller Temperature, (2) Sweller Concentration, ( 3) Sweller Depping Time; (4) Permanganate Temperature; (5) Permanganate Concentration; (6) Permanganate Dipping Time Wait. Because of the combination of control factors, the study will optimize the combination of experiments with the Taguchi method and optimize the operation parameters of the equipment. In this research paper, Taguchi experimental design L27 combination, and gradually explore the best combination of parameters. The combination of experiment L27 confirms the degree of influence of each factor, and the optimal parameter combination is 1.4um in the S/N ratio. The second experiment compares the Taguchi method optimization parameters with the case study company. After the experiment, the Taguchi method optimization parameter is the best operating parameter, and the relevant conclusions and recommendations are provided through the results of the experiment to provide The PCB( Printed Circuit Board) plant removes the operational parameters of the smear equipment for reference in future capacity expansion or Parameter studies. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
| Externí odkaz: |
|