The Application of Laser Gloving for Thin Substrate Punching Process
| Autor: | Shang Hsu, 徐 尚 |
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| Rok vydání: | 2016 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 105 Ball grid array becomes popular in advanced electronic package technology due to the demand of thinner and lighter package for 3C electronics. In convention, mechanical punching is the tool used for substrate separation of thin BGA substrate. However, issues of cracking in punching lead to low yield rate. This thesis is focused on the study of improving the punch process by the help of UV laser machining. In the experiments, parameters of laser cutting; such as laser power and cutting speed were investigated to achieve an optimized U shape of laser machining groove for the release of cracking in punching process. As a results, it showed that the laser U grooving process was effective to improve the yield of punching process. In addition, it was also found that deep groove can be achieved by higher power of UV laser cutting and was benefit to the quality of punching and the yield as well. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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