Design and Analysis of a Large Scale Abbe Error Free 3D Wafer Measurement Stage
| Autor: | Teng-Hui Tseng, 曾騰輝 |
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| Rok vydání: | 2017 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 105 This thesis developed a new Abbe error free 12" 3D wafer inspection stage. The wafer inspection stage consists of a granite frame, an xyz stage and a vertical probe positioning stage. The granite frame consists of a granite base for mounting the xyz stage and a granite gantry for mounting the vertical probe positioning stage. The xy stage is designed with the co-planar concept and box-in-box concept. The co-planar concept and box-in-box concept make the three elevations of the wafer surface, y-stage guide surface and x-stage guide surface are on the same z-plane. The movement of each stage is sensed by an individual laser interferometer, and the intersection point of the three axes of laser interferometers is located on the top of the wafer surface. In addition, the focus point of the vertical optical probe coincides with this intersection point of the three axes of laser interferometers. Therefore, the measuring system of the developed 3D wafer inspection stage fulfills the Abbe principle in 3 directions, and is an Abbe error free measuring system. The measuring range of this wafer inspection stage is 300mm x 300mm x 5mm, which fits the dimension of 12-inch wafers. To achieve high-precision positioning, both parallelism calibration and perpendicularity calibration of x-direction guides and y-direction guides are important in this wafer inspection stage. A calibration method using laser and pentaprisms is presented in this thesis. For this long travel range stage, the finite element method (FEM) is applied to analyze the structural deformation and vibration natural frequencies, the natural frequencies are measured by using impact hammer and Laser Doppler Vibrometer (LDV). |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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