Research of Microwave and Millimeter-Wave Distributed Amplifier and Stacked Power Amplifier Using Transformer-Based Voltage-Type Power Combining Technique
| Autor: | Chen-Wei Wu, 吳振緯 |
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| Rok vydání: | 2017 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 105 This thesis presents a CMOS compact and low dc power distributed amplifier (DA) and a CMOS power amplifier (PA) with high output power and compact size. Firstly, the conventional distributed amplifier (CDA) with cascaded single-stage distributed amplifier (CSSDA) gain stage using the feedback transformer for signal-coupling purpose implemented in 0.18-μm CMOS is proposed. It takes considerations of gain-bandwidth (GBW) products, dc power consumption, and chip size. By using the feedback-transformer, this DA reduces dc power consumption and achieve a compact chip size while maintaining the gain and bandwidth performances. This DA achieves 12-dB gain and 33.5-GHz bandwidth, which the gain variation is over 3 dB, with total dc power of 69 mW and the compact size of 0.72 mm^2. Secondly, the 60-GHz stacked-power amplifier implemented in 65-nm CMOS is designed with transformer (TF)-based voltage-type output combiner. This output combiner with only 0.9-dB insertion loss at 60 GHz and 0.02- mm^2 compact size is designed for high output power combining. The stacked-PA topology is adopted for increasing the supply voltage to the devices and the output power of the PA. The proposed power amplifier achieves saturated output power (P_SAT) of 22.8 dBm with 15.9% 〖PAE〗_max at 60 GHz excluding the loss of the output transformer and the chip size is only 0.28 mm^2 excluding the pads. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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