The Development and Constituents Analysis of Tin Palladium Solution used in Electroless Copper Nickel Plating
| Autor: | CHENG, CHIA-HAO, 鄭佳豪 |
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| Rok vydání: | 2018 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 106 Electroless plating is also called chemical plating or autocatalytic plating. Electroless plating means that metal ions in an aqueous solution are chemically reduced in a controlled environment. Commonly used polyester cloth after pre-treatment applied to the metal plating layer to make it a metal conductive fiber cloth can be divided into: copper-nickel conductive cloth, gold-plated conductive cloth, conductive carbon cloth and aluminum foil fiber composite cloth. The appearance of conductive cloth with plain and grid distinction can be used to engage in electronic/electromagnetic radiation shielding functional cloth, room dedicated shielding cloth, IT industry shielding special cloth, current popular touch screen gloves and radiation curtains etc. The tin palladium solution is usually electroless plating catalyst, mainly by the redox reaction through stannous chloride and palladium chloride to form palladium particle that can be divided into acid-based colloidal palladium and salt-based colloidal palladium. The salt-based colloidal palladium with sodium chloride to replace easily volatile hydrochloric acid can prevent the production of acid gas and improve the stability of tin palladium solution. The tin palladium solution of the cooperative enterprise contains about 8 M hydrochloric acid that concentration was titrated with sodium hydroxide, 1% palladium chloride, 33% stannous chloride and 7% sodium stannate analyzed by ICP-OES and iodine titration. In order to avoid the air oxidizing the stannous ions in tin palladium solution and destroy the tin palladium colloid, it is necessary to add stabilizers in the colloid solution. The stabilizer is identified as resorcinol and quantified about 5% with UV, GC, NMR and IR etc. instruments. The production of tin palladium solution is usually classified into one-step addition, two-step addition and three-step addition methods. This experiment uses the three-step addition method which can achieve the more stable resulting solution, after aging with suitable temperature and proper time control, the produced tin palladium solution has good stability. After carrying on the copper-nickel electroplating test, the conductivity of cloth maintains the resistance between 0.03-0.05 and the adhesion test maintains at 4-5 level, conforming to the specifications of the cooperative enterprise. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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