The Solar Wafer Cutting for Sludge Wash and Wastewater Treatment Technologies
| Autor: | YUN-CHIEH HUANG, 黃韻潔 |
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| Rok vydání: | 2015 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 104 The solar cell industry has been developed quickly in the past decade in Taiwan. During the process of wire-saw the silicon wafer, a large quantity of sludge has been accumulated. Such sludge will become a pollution problem to the environment. The purpose of this study is to develop a recycling technology for the kind of waste. In order to breakdown the stability of the sludge in water, the sludge is put into a NaOH solution for an oxidation reaction occurring. The clean powder will be derived through the processes of neutralization, water washing, precipitation, and drying. The clean powder can be used for the pigments and plastics as an additive. The high concentration toxic organic waste water generated from the processes will be treated by a Fenton method. The optimal conditions for FeSO4．7H2O and H2O2 to remove the total organic carbon (TOC) from the waste water will investigate through jar tests. The results show that the oxidation reaction can be occurred at the concentrations of 0.25N, 0.5N, and 1.0NNaOH water solutions. The oxidation reactions are exothermal reactions and the initial reaction temperature decreases with the increasing NaOH concentration in the water solutions. Also, the quantity of the waste water generated from the process increases with the increasing NaOH concentration. All the waste water is diluted to a TOC concentration of 250mg/l before treatment by Fenton method. The study finds that with enough reaction time more than 6 hr, the TOC reduction in the waste water will be higher than 94% with 0.7g FeSO4．7H2O and 10ml(H2O2,35wt%) add into 800ml waste water. Keywords：Wafer wire-saw sludge, Recycling, Waste water treatment, TOC reduction |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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