A Data-Aware Charge-Sharing Based Low Swing TSV Transmission Scheme for 3D IC with Wide I/O
| Autor: | Li, Pei-Yuan, 李培源 |
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| Rok vydání: | 2014 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 103 With the evolution of MOS technology based on Moore’s Law, we have to face the difficulties on designing and the bottleneck on physics and materials including increasing leakage current, RC delays on wire routing and yield issue. 3D integration has the most potential to solve these problems by using Though Silicon Via (TSV) technology and providing outstanding performance and high density advantage at the same time. However, there are many challenges for TSV-based 3D IC such as bad energy efficiency due to large loading, multi layer addressing and large TSV pitch. Therefore, the capability of achieving low energy efficiency by circuit design for 3D IC is the main target of our works. In the thesis, we propose a Data-Aware Charge-Sharing Low Voltage Transmission Scheme with Asymmetric Sense Amplifier to reduce the power consumption and solve the Vref selecting problems for conventional symmetric sense amplifier. A 1kb I/O macro has been fabricated in 65nm CMOS technology to verify the ideas of this works. The measurement results demonstrate the functionality of this works and the energy efficiency can achieve to 0.12 mw/Gbps. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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