A Scalable Global-Ring Based Architecture Supporting Parametric Fault Testing for Any-Bond TSVs
| Autor: | Zeng, Zeng-Fu, 曾增馥 |
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| Rok vydání: | 2014 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 103 This thesis presents an any-bond test method for TSV, and any-bond test means that including pre-bond, mid-bond, and post-bond test. We repeatedly use the same set of design-for-testability circuits to achieve our test method. In our test architecture, all the test wrappers are cascaded one after another to form a global ring oscillator, and we use daisy-chain and test access protocol controller to support our test method. By doing so, the test-result retrieval problem in previous local-ring based method can be alleviated. Even though our method can’t achieve the 100% fault location coverage for overall TSV in the pre-bond stage, we can do that in post-bond stage. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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