Study of Power Integrity Simulation and Decoupling Capacitor Placement for High Density Interconnect PCB

Autor:	Chih-Kang Chang, 張致綱
Druh dokumentu:	學位論文 ; thesis
Popis:	103 The thesis studies High Density Interconnect Printed Circuit Board (HDI PCB)power plane detection by a simulation tool. It can assist designer to evaluate existing PCB placement and decoupling capacitor whether these comply with power integrity requirement in a short time. Power integrity has strong relationship with signal integrity. Stable and low-noise power is basic for signal integrity with good performance, and good signal integrity will effectively increase system stability and reliability. In the past years, hardware designers always need real PCB assembly samples for verification and error detection. Therefore. This traditional approach will increase sample quantity, cost and design cycle time significantly. This study discusses the relationship between power impedance, power integrity and decoupling capacitor by simulation tool. It will assist designer to discover defects of power design on PCB layout arrangement more effectively, and define PI simulation SOP to achieve the targets of cost saving and design cycle time reduction.
Databáze:	Networked Digital Library of Theses & Dissertations
Externí odkaz:	http://ndltd.ncl.edu.tw/handle/66844079541575915168 Zobrazit plný text záznamu