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| Autor: | Rui-Sheng Lin, 林瑞晟 |
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| Rok vydání: | 2015 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 103 By the principle of the fluid of heat pipe heated in the high temperature area, the density and the ration become lower; therefore, the temperature goes higher. On the contrary, the high density and ration of the cold fluid goes down, replacing the rising part. The cold fluid goes up again when heated. The alternating phenomena lead to convective transfer of capacity formation. According the principle, the thermal cycling is carried out on lamps and lanterns. In addition, each of the modulation factor and parameter is set during simulation. The result of simulation is received by using the simulation software, COMSOL Multiphysics. To analyze the result of each group helps to understand how to obtain the most advanced heat pipe device and to lower the highest temperature and LED lamp. The highest temperature is 46.9℃ in the beginning of designed simulation. temperature of LED chip, 40.8℃, and aluminum substrate, 28.2℃～30℃, and the surface of lamps and lanterns, 30℃～32℃. Therefore, the highest temperature decreases on the aluminum substrate of the main part of lamps and lanterns and the surface of LED. Consequently, the temperature of aluminum substrate declines dramatically to attain the fine effects of heat dissipation, beneficial to the cooling design of LED. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
| Externí odkaz: |
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