Solid Hearing Aid Head Band Mold Flow Analysis
| Autor: | HUNG,CHIAO-YU, 洪巧玉 |
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| Rok vydání: | 2015 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 103 In this paper, we use of Moldex3d mold flow analysis software to analyze solid headband hearing aids. Solid headband hearing aid is used software Moldex 3D materials library PA6 TECHNYL C218 V15 Rhodia, PA6 TECHNYL C218 V30 Rhodia, PA6 TECHNYL C218 V50 Rhodia and MIM Catamold 316 LA BASF SE, and different pouring styles to analyze water cooling and filling balance. Materials like PA6 TECHNYL C218 V15 Rhodia、PA6 TECHNYL C218 V30 Rhodia and PA6 TECHNYL C218 V50 Rhodia are analyzed clamping force, shear stress, total fiber alignment, total thermal displacement and total displacement volume shrinkage. Moreover, the results can be chosen optimal condition for three types of injection conditions. These three mold flow analysis for water cooling types are took into comparison, the material for PA6 TECHNYL C218 V50 Rhodia's overall thermal displacement, the total displacement and volume shrinkage results are the best. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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