Towards thermoconductive, electrically insulating epoxy composites with AlN micro/nano fibrous network as fillers
| Autor: | Chan-Hao Kuo, 郭展豪 |
|---|---|
| Rok vydání: | 2015 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 103 As the development of electronic components in the direction of miniaturization, high-power, and high integration, it requires more and higher performance, so the waste heat generated by the operation of components, need to be ruled out quickly, otherwise it will reduce the performance of electronic components. High thermal conductivity polymer composite materials with high thermal conductivity and high-performance are the most widely used in electronic components. This study is using electrospinning method to prepare electrically insulating but high thermal conductivity three-dimensional (3-D) micron network AlN fillers and applied to enhance thermal conductivity of AlN/epoxy composites. Commonly, to enhance thermal conductivity of polymer matrix composite via high AlN powders loading in matrix. To improve the common process, plans to add modified 3-D micron network AlN fillers to the epoxy matrix and form the pathway for heat conduct. From the image of SEM, indicate the AlN fillers with 3-D micron network structure and high aspect ratio (> 50), and identified as hexagonal system AlN by XRD (JCPDS 25-1133), XPS, and TEM. The specific surface area of AlN fibers is 10 times higher than the AlN powder by physical adsorption-desorption analyzer. The AlN/epoxy composites using a thermal conductivity meter (Hot-Disk) to detect the heat transfer coefficient, was prepared from commercially available aluminum nitride powder, fiber and modified powder, fiber as filler to 60 wt% added to the epoxy substrate, the thermal conductivity were 0.67, 0.85, 0.76, 0.91 W/mk, Successively upgrade 235 %、325 %、280 %、355 %, this conclusion can be observed the filler which were modified has the better thermal conductivity, by using SEM observe the surface morphology of cross section can be found within the composites material is modified through the addition of materials and organic substrates interface significantly reduced, which can be attributed to the additional material form a bond with an epoxy resin. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
| Externí odkaz: |
|