Wafer Pin Measurement Technique by Embedded Vision System

Autor: Teng-Hsiang Chang, 張登翔
Rok vydání: 2015
Druh dokumentu: 學位論文 ; thesis
Popis: 103
This paper proposed an embedded vision measurement wafer pin technology. It can be used in measurement of position between wafer pin and Soldering metal bumps. On the current market, automatic detection products are mostly based on vision system, and the maintenance upgrading is not only inconvenient but also expensive. So, we design small embedded vision measurement system with image processing technology for cost down and convenient for maintenance and upgrade embedded vision system. In this paper, we use the digital microscope camera to capture images by Ubuntu embedded system that uses our imaging algorithm to carry out the experiment. The image measurement system creates web user interface to allow user input image patterns and parameters. To comparison more LCD chips with image pattern and parameters for checking if the gap measurement range position is within the specified range and qualified the measurement of wafer pin with Soldering.
Databáze: Networked Digital Library of Theses & Dissertations