Semiconductor Bumping manufacturing stripper recipe develop
| Autor: | Chen, YiHan, 陳奕翰 |
|---|---|
| Rok vydání: | 2013 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 101 To complete semiconductor components requires many processes while photoresist liquid (stripper) is the most important indirect material in photo lithography. For one wafer, the suitable stripper can not only remove photo resist entirely, but also not attack the metal film and metal bump under the photo resist. The main purpose of this dissertation aims to develop stripper used by semiconductor industry. The technology industry in Taiwan focuses on semiconductor industry, but most of the stripper technology still lies in the hands of foreign manufacturers, so hopefully, the international competitiveness of the overall technology industry could be enhanced by this study. The main experimental procedures and steps are settled to test the status of the photo resist (residues and metal attack) with various recipe along with recipe’s shelf life and capacity. This study is to simulate the process conditions (temperature、process mode) with beaker to remove photo resist and then to see if there is photo resist residue or metal being attacked with OM and SEM, and finally, to test recipe’s shelf life and the maximum amount of dissolution. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
| Externí odkaz: |
|