Study of Material Properties of Plastics Material on Damage of Electronic Package
| Autor: | Ying-Long Wang, 王應龍 |
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| Rok vydání: | 2012 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 100 The effects of material properties of two molding compound on the chip cracking during the package ejection process are studied. The interface between the package and the molding die is simulated by the nonlinear contact conditions. The bending stresses on the chip caused by the ejection force and package deformation are calculated. The defect rates of chip during the ejection process are estimated by maximum bending stress and chip strength. The result shows that the molding compound with higher Young’s modulus and lower coherent force can reduce the defect rate. The second part studies the bonding strength between the interfaces of the die attaches and lead frame. The critical load of the interface is measured by the four-point bending experiment. Finite element simulation is used to perform the stress analysis. Then energy release rate is calculated by the simulation results. The interface formed by two lead frames and three die attach are studied. The result shows that the package with die attaches of higher critical energy release rate, the defect rate of package delamination is lower. Further, the second stress intensive factor of metal is estimated by the shear box test. The critical load is measured by the test. Finite element is used to calculate the stress intensive factor. The simulated value is verified by the theoretical value. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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