Interfacial Reactions in the Cu/Sn/In/Ni/Cu Multilayers Structure in 3D IC Packaging
| Autor: | Pin-Ju Huang, 黃品儒 |
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| Rok vydání: | 2012 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 100 With the development of technology, the 3-D IC packaging tends to replace the traditional 2-D packaging technology in the future. Flip chip (FC) technique is one of the methods in 3-D IC packaging. Recently, the copper pillar bump was used to replace tin-lead bumps for the reason that it could provide fine pitch without bump bridging and smaller amount of solder is needed. In this study, the Cu pillar/Sn and In/Ni/Cu multilayer structure were fabricated by the electroplating method. In the solid-liquid inter-diffusion (SLID) bonding process, Sn-In was used as a bonding layer to effectively reduce the soldering temperature. We hope this Cu pillar/Sn/In/Ni/Cu multilayer structure could act as the solder to replace conventional lead-free solder and be applied in 3-D IC packaging. The results indicate (Cu,Ni)6(Sn,In)5 phase were formed on the Cu pillar side in different temperature systems and the rough layer, which can be found in the middle, was ? phase. When the reflowing temperature was 180 oC, the intermetallic compounds (IMCs) formed from Cu pillar side to Ni side were Cu pillar/(Cu,Ni)6(Sn,In)5 /?? Ni. After aging for 10 h, the (Cu,Ni)6(Sn,In)5 and (Cu,Ni)(In,Sn)2 phases were formed at interface close to the Ni side. In addition, the IMCs didn’t change and the area of ? phase was reduced when we increase aging time. In the other system, couple was reflowed at 200oC, the IMCs formed from Cu pillar side to Ni side were Cu pillar/(Cu,Ni)6(Sn,In)5/??}(Cu,Ni)6(Sn,In)5/Ni. The (Cu,Ni)6(Sn,In)5 phase was formed more rapidly than 180 oC system on the Ni side. With longer aging time, the (Cu,Ni)(In,Sn)2 was formed at the interface close to the Ni side and the ??nphase was consumed completely. When aging for 300 h, the IMCs formed from Cu pillar side to Ni side were Cu pillar/ (Cu,Ni)6(Sn,In)5/ (Cu,Ni)(In,Sn)2/Ni, which was significantly different compared to the as-reflowed. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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