The Analysis of Taiwan's TSV 3D IC Industry Structure and Development Trend
| Autor: | Liao, Wen-Chieh, 廖文傑 |
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| Rok vydání: | 2012 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 100 In the Post-PC Era, the growing popularity of various types of light and convenient electronic mobile device, prompting the development of electronic products to the trend of lighter, thinner, smaller. Therefore, it’s inevitable the electronic component goes to miniaturization and high density. This also means the semiconductor chips are required to provide a higher storage unit per area, and faster response speed level to cope with future strong demand. Taiwan's semiconductor industry has always maintained a global competitive advantage by its vertical specialization. However, In the 3D IC development needs strong cooperation with upstream and downstream industries. This kind of cooperation model will bring a considerable impact to Taiwan's semiconductor industry. This study base on the five-power analysis and SWOT analysis framework, and focus on the industry's prospects, the future direction of development of the industry and competitive conditions within the industry. In addition, this study explores the processes and applications of 3D IC’s future, as well as customer preferences and considerations for this new technology industry cooperation model, the traction problem of how to restructure the role of the vertical division of Taiwan's semiconductor industry. The competition analysis uses Porter’s five force model as a base structure to understand the 3D IC’s suppliers, customers, competitors, new comers, substitute status, and then use SWOT to analyze leading company’s strength, weakness, opportunity, and threat. In sequence, this study comes out some strategic suggestions for other vendors in 3D IC industry. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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