Study of Micro-Milling for PZT Thin Film Using Diamond Coated Tool

Autor: Yen-Cheng Chou, 周彥成
Rok vydání: 2012
Druh dokumentu: 學位論文 ; thesis
Popis: 100
The demand for manufacturing complex device made of brittle material increases dramatically due to its specific characteristics compared metal and polymer materials. However, the low machinability of brittle material still challenges its applications on the mass production line. In tradition, semiconductor process is used for machining the thin film made of brittle material. However, low efficiency and quality on etching PZT thin film increase the cost and flexibility for pattern generation. Therefore, how to make a device made of PZT material more efficiency and flexible draws an attention lately. This research focus on the study of machinability for PZT thin film using diamond coated end mill to develop a more efficiency and lower cost solution to manufacturing the PZT thin film device. The effect of the cutting parameters such as depth of cut, feed rate, tool geometry, cutting velocity on the brittle/ductile chip generation is discussed, as well as the effect from the tool wear level. The critical depth of cut and critical feed rate for generating the ductile chip was determined based on the observation of chip type and chipping on the top side surface of machined slot. Except for the PZT thin film, the silicon wafer was also investigated as a reference with the same cutting condition. To investigate the cutting velocity effect on machining performance, three size of cutting tool was used in this study to generate different cutting velocity. In monitoring the transition from brittle chip to ductile chip, a Kistler dynamometer was used to measure the cutting force change during cutting. The experimental results show that tool life can be improved by coating diamond thin film on the tool in cutting brittle material. By compared to silicon wafer, PZT thin film provides the lower value of critical depth of cut for ductile chip generation. At the same time, higher value of critical depth of cut was observed by implementing CVD diamond coated tool than diamond grinder with the same diameter as CVD diamond coated tool. In the analysis of tool wear effect on the ductile mode machining, tool wear makes the chip generation closer to ductile mode machining than sharp tool with the same depth of cut.. With the tool wear increases, the higher cutting speed will make the ductile mode machining available than the lower speed cutting. To investigate the two sides of generated slot, the side with up milling provides the higher value of critical depth of cut than down milling side.
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