A Novel Synthesis Method of Cu Nanoparticles and Their Applications as Catalyst for Seed Layer Deposition on Through Silicon Via
| Autor: | Yiu-Hsiang Chang, 張佑祥 |
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| Rok vydání: | 2011 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 99 Because the development of science and technology continuously progresses, electronic products tend toward high density, thinness, portable and Multi-function. Therefore, 3D IC stacking technology will be carried out in next generation. Through Silicon Via (TSV) plays an important role in 3D IC stacking technology. Before TSV formation by electroplating, TSV must have a good barrier layer, such as Ti/TiN or Ta/TaN, and a seed layer coated on isolation layer (SiO2). So far, typical procedure that forms barrier layer and seed layer is CVD or PVD. But these processes have two fatal problems. One is poor step coverage and conformality in the high-aspect-ratio via and trench; the other is high cost for mass production. For those reasons, we propose a novel procedure for barrier layer and seed layer formation by electroless deposition. In other words we choose wet process to form barrier layer and seed layer. In this study we developed a novel synthesis method of copper nanoparticles (CNPs) as catalyst for TSV seed layer formation. Therefore, this study is separated into two parts. One is CNPs formation; the other is to form seed layer by copper electroless deposition (Cu ELD) using the CNPs as catalysts. First part, we synthesized CNPs by a novel method. This method is obtained from copper metallization on polyimide (PI) film, so that the procedure includes KOH treatment to form poly (amic acid) (PAA), ion exchange to form Cu2+ doped PAA, doped Cu2+ reduction by aqueous Dimethylamine Borane (DMAB) with a trace amount of additive to form CNPs in the DMAB solution. The key point is the additive which must have mercapto group. Second part, we proposed a novel method for CNPs grafting on barrier layer (Co-W-P). After CNPs grafting, Cu seed layer was formed by Cu ELD. The grafting strategies include positive and negative charges attraction, and peptide bonding etc. The role of copper nanoparticles is catalyst to catalyze Cu ELD for seed layer formation. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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