Study of Delamination for Die Attach Process in IC Assembly
| Autor: | Su Chan Chih, 蘇展志 |
|---|---|
| Rok vydání: | 2010 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 99 The application of Die Attach Film (DAF) has greatly improved the quality for IC assembly. It is also a cost effective technology getting more and more interesting in industry. Warpage, delamination and cracking are problems common found during IC assembly. Void formation within adhesive at the interface between chip and substrate can cause delamination. In this study, process optimization for die attach process using DAF is investigated to reduce void formation. Bond head, bonding pressure and curing pressure are analyzed for optimization using Design Expert. Results show that increase in both bonding and curing baking pressure can reduce the void formation while type of bond head shows the dominant influence. Keywords : DAF, Delamination, Void, Optimization design, Response Surface Methodology |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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