New product development by integrating FMEA and QFD－A case study of the processes of transistor and packaging

Autor:	Kun-yu Lai, 賴坤裕
Rok vydání:	2010
Druh dokumentu:	學位論文 ; thesis
Popis:	98 The purpose of this paper is to integrate QFD (Quality Function Deployment, QFD) and Failure Mode and Effect Analysis (Failure Mode and Effects Analysis, FMEA) in the transistor package, development of new products, so that the needs of customers through Quality Function Deployment and the financial into the process at all and the application of Failure Mode and Effect Analysis in order to prevent the trial production stage, the occurrence of potential failure and reduce the number of design changes to enhance product packaging yield, and make the new product to reduce the rate of customer complaints and better meet the needs of customers.
Databáze:	Networked Digital Library of Theses & Dissertations
Externí odkaz:	http://ndltd.ncl.edu.tw/handle/70647622008626115501 Zobrazit plný text záznamu