Mechanical Properties of Sn-Ag-Cu-In-Zn Leader-free Solders at Ambient and Elevated Temperatures
| Autor: | Yung-Cheng Lai, 賴永丞 |
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| Rok vydání: | 2010 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 98 Today, lead-free solder alloys are commonly used in electronic packaging interconnects. In order to develop a new lead-free solder which possess a melting temperature about 183℃. A series of Sn-Ag-Cu-In-Zn solders were evaluated in this study. The mechanical properties of the bulk Sn-Ag-Cu-(4~8)In-(1~3)Zn solders are reported by tensile test at a crosshead of 10-3mm/s and various temperatures. The Sn-3Ag-0.5Cu-8In-1Zn solder possessed a solidus and liquidus between 188℃ and 196℃. This can be compared to the traditional Sn-Pb solder with a melting point around 183℃. Ag3Sn, Cu3Sn and InSn phases were found in the solder matrix. The ultimate tensile strength ( UTS ) and elongation were 15.05MPa and 17.79％ at a crosshead speed of 10-3mm/s at room temperature. The flow-stress levels of the solder at the lower homologeous temperature were higher than those at high homologeous temperatures. Before fracture, several voids nucleated along grain boundaries. A typical intergranular fracture mode was found in the Sn-3Ag-0.5Cu-8In-1Zn solder. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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