High Strain Area and Microsample for Deformation Measurement by Using Digital Image Correlation Method
| Autor: | Wei-jie Wu, 吳偉傑 |
|---|---|
| Rok vydání: | 2009 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 97 Digital image correlation (DIC) is a whole-field, non-contact and non-destructive strain measuring method. This method captures the surface of a sample before and after the deformation to find displacement and strain of a specific subset region. In this work, an adaptive real-parameter genetic algorithm is proposed to search the optimum solutions. An ideal experiment without the error of the CCD sensor and lighting is used to verify the accuracy of this method. Uniaxial tensile tests of specimens adhered with strain gauge are also executed, and stable lighting and random speckle pattern are provided to ensure the experiment quality. The value of the strain gauge can be used to verify the accuracy of the program on the uniaxial tensile test. Then, the specimen with a central circular hole is also tested and the strain distribution especially around the high strain area is measured by the present method. Finally, fabricate the micro specimen, micro-electro-mechanical system (MEMS) is adopted to fabricate the micro specimen for uniaxial tensile tests. In this study, the results indicate that strain distribution around the high strain area could be reasonably measured, and fracture region of the specimen could be predicted. At the same time, we could find that the Young’s modulus of Cu thin specimen is around 97.9GPa. The feasibility of DIC could be verified during these tests. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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